-
中国3月份生产了294亿块集成电路（IC），比一年前只下降了3%，表明中国的芯片产量在复苏。
-
国家统计局调整了增长数据，以反映其样本中包括的公司的变化。
-
美国加强了出口管制，限制中国生产先进芯片的能力，导致中国加倍推动自给自足。
-
第一季度集成电路进口量下降到1082亿个，比一年前下降了近23%。
-
中国第一季度的国内总产值增长了4.5%。
-
亚洲一直受到半导体销售低迷的影响，但市场应该在2023年中期触底反弹。
-
新的趋势，如电动汽车的增长，可能会推动半导体领域的需求。
-
由美国支持的亚洲开发银行在本月早些时候的一份报告中说，市场应该在2023年中期触底反弹。
-
中国的芯片产量恢复表明这个世界第二大经济体有更广泛的改善。
-
China produced 29.4 billion units of integrated circuits (ICs) in March, down only 3 per cent from a year ago, indicating a recovery in China’s chip output.
-
The National Bureau of Statistics adjusted growth data to reflect changes in the companies included in its samples.
-
The US has tightened export controls to restrict China’s ability to produce advanced chips, leading China to double down on its self-sufficiency drive.
-
IC imports fell to 108.2 billion units in the first quarter, down nearly 23 per cent from a year ago.
-
China’s gross domestic output expanded 4.5 per cent in the first quarter.
-
Asia has been suffering from a downturn in semiconductor sales, but the market should bottom out by mid-2023.
-
New trends, such as growth in electric vehicles, are likely to drive demand in the semiconductor sector.
-
The US-backed Asian Development Bank said in a report earlier this month that the market should bottom out by mid-2023.
-
China’s chip output recovery indicates a broader improvement in the world’s second-largest economy.
爛尾加速中。